Hello,
I am looking for help and technical advice in order to find the right method to carry out an accurate survey of a plate with holes used for wiring, covered with many nails arranged very close to each other.
I currently have two plates:
a plate of 1 m × 2 m;
a 3 m × 2 m plate.
The nails are extremely numerous and almost side by side over the entire surface. In addition:
the nails are not all at the same height;
some are slightly inclined;
The metal surface creates a lot of reflections.
My goal is to get:
The exact position of the holes in order to be able to do 3D and 2D.
I've already tried several approaches:
manual measurements by the meter; 3D scanner.
But the results are not precise enough. Manual measurements are extremely time-consuming and inaccurate. As for the 3D scanner, it did not give good results because of the reflections of the nails or their very close proximity, and the inclinations of some nails. The scanner often merges elements or loses important geometric information.
I am therefore looking for a more suitable method to accurately record the position of the holes on this wiring board in order to rebuild a reliable 2D and 3D model.
Thank you in advance for your help.
Ludo